| Nom De Marque: | ODM OEM |
| Numéro De Modèle: | Assemblée de carte PCB de SMT |
| MOQ: | 1 pièces |
| Prix: | negotiable |
| Conditions De Paiement: | Union occidentale, T/T |
| Capacité à Fournir: | Double Face : 12000 m²/mois Multicouches : 8000 m²/mois |
| Challenge | Description |
|---|---|
| ❌ Hidden Defects = Field Failures | BGA and QFN solder joints look fine on the outside, but voids and cold joints cause failures after 6-12 months in the field. Warranty claims skyrocket. |
| ❌ No Traceability = Recall Nightmare | When a quality issue surfaces, you can't pinpoint which batch, which machine, or which operator. Recalls become expensive guesswork. |
| ❌ Consumer-Grade Lines = Automotive Risk | Standard SMT shops skip SPI, run cheaper components, and have no process control. They can't meet IATF requirements or PPAP documentation. |
| Solution | Description |
|---|---|
| 🛡️ Zero-Defect Inspection | 3D SPI → 3D AOI → X-Ray triple inspection on every board. BGA void rate ≤ 5%, verified per IPC-A-610 Class 3 standards. No hidden surprises. |
| 🔍 Full Traceability, Down to the Joint | Every board tracked by serial number through MES. Component lot, solder paste batch, reflow profile, inspection images — all linked and stored for 7+ years. PPAP-ready. |
| ⚡ Prototype → Production, Seamlessly | Start with 5 samples on rapid prototyping lines. Scale to 50,000+ on dedicated standard lines. Same quality system, same traceability, every step. |
| Minimum Component | 0201 (0.6 × 0.3 mm) |
| Maximum Component | 55 × 55 mm |
| Minimum BGA Pitch | 0.3 mm |
| Minimum IC Pitch | 0.35 mm |
| Placement Accuracy | ±0.035 mm |
| Rejection Rate | ≤0.3% (passives) / 0% (ICs) |
| Process Cpk | ≥ 1.0 (3σ) |
| Board Thickness | 0.3 - 6.5 mm |
| Max Board Size | 460 × 510 mm |
| PCB Layers | 1 - 32 layers |
| SMT Lines | 300+ (Yamaha YSM20 / YSM10) |
| Production Mode | Prototype → Low-volume → Mass |
| Inspection Stage | Inspection Items | Coverage |
|---|---|---|
| Incoming QC | Component authenticity, COC verification, lot registration | 100% of materials |
| 3D SPI | Solder paste volume, height, alignment, bridging | 100% of boards |
| 3D AOI | Missing parts, polarity, tombstone, offset, bridging, insufficient solder | 100% of boards |
| X-Ray Inspection | BGA / QFN hidden joints, void rate measurement | All BGA/QFN components |
| Final QA | Visual inspection, dimensional check, functional test (on request) | AQL sampling or 100% |
| Indicator | Value | Standard |
|---|---|---|
| First-Pass Yield | ≥ 98% | IPC-A-610 Class 3 |
| BGA Void Rate | ≤ 5% | IPC-7095 |
| Solder Paste Tolerance | ±15 µm | 3D SPI verified |
| Step | Process | What Happens |
|---|---|---|
| 1 | 📥 Order Review & DFM | Engineers review Gerber + BOM, flag any design issues |
| 2 | 📦 Material Preparation | Components sourced, PCB fabricated, incoming quality check |
| 3 | 🔬 Solder Paste Printing | Precision stencil printing with 3D SPI verification |
| 4 | 🤖 Component Placement | Yamaha high-speed placement, 0201 to BGA 0.3mm |
| 5 | 🔥 Reflow Soldering | Controlled temperature profile, 240±5°C (adjustable) |
| 6 | 🔍 AOI + X-Ray Inspection | 100% optical + X-Ray on BGA/QFN |
| 7 | 🔧 Additional Processes | DIP / conformal coating / underfill / functional test |
| 8 | ✅ Final QA & Packing | Final inspection, ESD packaging, shipping preparation |
| Advantage | Description |
|---|---|
| 🏆 IATF 16949 Certified | Manufactured in IATF 16949 certified facilities with full automotive quality systems. PPAP, FMEA, and control plans available on request. You're not buying from a garage shop. |
| 🔍 Full MES Traceability | Every board has a serial number. Every component lot, every reflow profile, every inspection image — stored and retrievable for 7+ years. Audit-ready, always. |
| ⚡ Dual-Mode Production | Start with 5 prototypes on rapid lines. Scale to 100k+ on dedicated automotive lines. Same quality system, zero requalification headaches. |
| 🏗️ One-Stop Turnkey | PCB fabrication → component sourcing → SMT assembly → DIP → coating → testing. One PO, one contact, zero coordination overhead. Focus on your design, we handle the rest. |