All Products
-
PCBA Board Assembly
-
Industrial Control PCB Assembly
-
Medical PCB Assembly
-
Communication PCB Assembly
-
Automotive PCB Assembly
-
Drone PCB Board
-
HDI PCB Board
-
High Layer PCB
-
High Frequency PCB
-
High Speed PCB
-
5G Optical Module PCB
-
Semiconductor PCB
-
Thick Copper PCB
-
Industrial Control PCB
-
Consumer Electronics PCB
-
Rigid Flexible PCB
-
RF Antenna PCB
High Rank High Layer PCB 3mil Min. Line Width Spacing For Communications
Lead Time: | 3-5 Days |
---|---|
Silkscreen Color: | White, Black, Yellow |
Rohs Compliant: | Yes |
White Solder Mask Multi Layer Circuit Board 0.15mm Min. Silkscreen Clearance
Min. Hole Size: | 0.2mm |
---|---|
Solder Mask Color: | Green, Blue, Black, Red, Yellow, White |
Board Thickness: | 0.2mm To 6.0mm |
Red Solder Mask High Layer PCB OSP Multilayer Printed Circuit Board
Layer Count: | High Layer |
---|---|
Copper Thickness: | 1/3 Oz To 2 Oz |
Min. Line Width/Spacing: | 3mil/3mil |
HASL Surface Finish pcb printed circuit board High Layer FR-4 Material
Material: | FR-4 |
---|---|
Lead Time: | 3-5 Days |
Copper Thickness: | 1/3 Oz To 2 Oz |
Immersion Silver High Layer PCB Multi Layer Circuit Board OSP Surface
Rohs Compliant: | Yes |
---|---|
Board Thickness: | 0.2mm To 6.0mm |
Lead Time: | 3-5 Days |
Immersion Tin Multilayer Pcb Manufacturing Min Hole Size 0.2mm
Lead Time: | 3-5 Days |
---|---|
Min. Line Width/Spacing: | 3mil/3mil |
Min. Silkscreen Clearance: | 0.15mm |
Yellow Solder Mask High Layer PCB Multilayer Flexible Pcb 0.2mm Thickness
Min. Hole Size: | 0.2mm |
---|---|
Material: | FR-4 |
Min. Line Width/Spacing: | 3mil/3mil |
S1000-2M High Layer PCB Hdi Pcb 2 N 2 J121001F22 Internal Model
Application: | / |
---|---|
Characteristic: | Step Hard Gold Finger+back Dill+blind Via |
Material: | S1000-2M |
36 Layer 2 Level Multilayer Metal Core Pcb HDI Version Semiconductor Test Board
Application: | Semiconductor Test PCB |
---|---|
Characteristic: | 2 Lasers, Aperture Ratio 24:1 |
Material: | S1000-2m |