China HDI High Density Interconnect PCB 36 layer S1000-2M Material

HDI High Density Interconnect PCB 36 layer S1000-2M Material

Application: Semiconductor Test PCB
Characteristic: Laser Drill, Aperture Ratio 24:1
Material: S1000-2m
China Rogers 4003c Printed Circuit Board Semiconductor Min 0.0078”Drilling Size

Rogers 4003c Printed Circuit Board Semiconductor Min 0.0078”Drilling Size

Material: FR-4
Surface Finish: ENIG
Usage: OEM Electronics
China Turnkey Assembly PCB Semiconductor Circuit Board OEM Electronics

Turnkey Assembly PCB Semiconductor Circuit Board OEM Electronics

Through Hole Technology: No
Min Hole Size: 0.2mm
Pcba Service: Turnkey Assembly PCB Service
China Turnkey Assembly Semiconductor PCB Through Hole Technology

Turnkey Assembly Semiconductor PCB Through Hole Technology

Lead Time: 1 Weeks
Through Hole Technology: No
Feature: FR4 High TG
China ENIG Semiconductor PCB 14 Layer Turn Key Assembly Rogers 4003c

ENIG Semiconductor PCB 14 Layer Turn Key Assembly Rogers 4003c

Min Trace Width: 0.1mm
Drilling Size: Min 0.0078”(0.2mm)
Pcba Service: Turnkey Assembly PCB Service
China Gold plating Semiconductor PCB Rogers 4003c With Blind Microvias

Gold plating Semiconductor PCB Rogers 4003c With Blind Microvias

Lead Time: 2 Weeks
Solder Mask Color: Green
Surface Finish: Gold Plating 30U"
China Rogers  PCB Semiconductor Circuit Board High Efficiency Gold plating Finish

Rogers PCB Semiconductor Circuit Board High Efficiency Gold plating Finish

Impedance Control: No
Usage: OEM Electronics
Feature: High TG
China Green Soldermask Full Turnkey PCB Assembly  ENIG Surface Finish

Green Soldermask Full Turnkey PCB Assembly ENIG Surface Finish

Through Hole Technology: No
Solder Mask Color: Green
Special: Blind Microvias
China Blind Microvias Semiconductor PCB Green PCB Board With Min Hole Size 0.2mm

Blind Microvias Semiconductor PCB Green PCB Board With Min Hole Size 0.2mm

Layer Count: 12
Impedance Control: No
Feature: Rogers 4003c+FR-4
China Function Test Semiconductor PCB Smt Breakout Board FR-4  Gold plating

Function Test Semiconductor PCB Smt Breakout Board FR-4 Gold plating

Material: FR-4
Min Hole Size: 0.2mm
Surface Finish: Gold Plating 50U"
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