All Products
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PCBA Board Assembly
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Industrial Control PCB Assembly
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Medical PCB Assembly
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Communication PCB Assembly
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Automotive PCB Assembly
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Drone PCB Board
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HDI PCB Board
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High Layer PCB
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High Frequency PCB
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High Speed PCB
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5G Optical Module PCB
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Semiconductor PCB
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Thick Copper PCB
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Industrial Control PCB
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Consumer Electronics PCB
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Rigid Flexible PCB
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RF Antenna PCB
HDI High Density Interconnect PCB 36 layer S1000-2M Material
Application: | Semiconductor Test PCB |
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Characteristic: | Laser Drill, Aperture Ratio 24:1 |
Material: | S1000-2m |
Rogers 4003c Printed Circuit Board Semiconductor Min 0.0078”Drilling Size
Material: | FR-4 |
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Surface Finish: | ENIG |
Usage: | OEM Electronics |
Turnkey Assembly PCB Semiconductor Circuit Board OEM Electronics
Through Hole Technology: | No |
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Min Hole Size: | 0.2mm |
Pcba Service: | Turnkey Assembly PCB Service |
Turnkey Assembly Semiconductor PCB Through Hole Technology
Lead Time: | 1 Weeks |
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Through Hole Technology: | No |
Feature: | FR4 High TG |
ENIG Semiconductor PCB 14 Layer Turn Key Assembly Rogers 4003c
Min Trace Width: | 0.1mm |
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Drilling Size: | Min 0.0078”(0.2mm) |
Pcba Service: | Turnkey Assembly PCB Service |
Gold plating Semiconductor PCB Rogers 4003c With Blind Microvias
Lead Time: | 2 Weeks |
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Solder Mask Color: | Green |
Surface Finish: | Gold Plating 30U" |
Rogers PCB Semiconductor Circuit Board High Efficiency Gold plating Finish
Impedance Control: | No |
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Usage: | OEM Electronics |
Feature: | High TG |
Green Soldermask Full Turnkey PCB Assembly ENIG Surface Finish
Through Hole Technology: | No |
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Solder Mask Color: | Green |
Special: | Blind Microvias |
Blind Microvias Semiconductor PCB Green PCB Board With Min Hole Size 0.2mm
Layer Count: | 12 |
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Impedance Control: | No |
Feature: | Rogers 4003c+FR-4 |
Function Test Semiconductor PCB Smt Breakout Board FR-4 Gold plating
Material: | FR-4 |
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Min Hole Size: | 0.2mm |
Surface Finish: | Gold Plating 50U" |