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36 Layer 2 Level Multilayer Metal Core Pcb HDI Version Semiconductor Test Board

  • 36 Layer 2 Level Multilayer Metal Core Pcb HDI Version Semiconductor Test Board
Place of Origin Shenzhen, China
Brand Name Ben Qiang
Certification ISO/TS16949/RoHS/TS16949
Model Number FR-4/Rogers
Minimum Order Quantity 1PCS
Price custom made
Packaging Details Air bead vacuum packaging
Delivery Time 3-7 days delivery
Payment Terms Bank Transfer/Alipay/PayPal
Supply Ability 200,000 square meters/year

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Product Details
Application Semiconductor Test PCB Characteristic 2 Lasers, Aperture Ratio 24:1
Material S1000-2m Layer 36L
Thickness 4.8mm±0.24mm Min Hole Diameterv Laser Hole: 0.10mm; Mechanical Hole: 0.2mm Aperture Ratio: 24:1
Min Width/space 150/95um Surface Finish Immersion Gold 3U"
Internal Model S330V85C36
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36 Layer Multilayer Metal Core Pcb

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Multilayer Metal Core Pcb HDI
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Product Description

36-layer 2-level HDI version semiconductor test board

Project PCB process capability
Layer count 1-40 Layers
Min outer line width/space 3/3mil
Outer copper thickness 280um(8OZ)
Inner copper thickness 210um(6OZ)
Tolerance of PCB thickness board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers
board thickness＞1.0mm; ±10%
Minimum PTH Mechanical hole 4mil, laser 3mil
Material FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide
HDI Levels 2-7
Special Process

Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance;
Tags:

Hdi Pcb

Pcb Circuit Board

Multilayer Flexible Pcb