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Rigid Flex PCB Assembly
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Blue Soldermaskcolor Rigid Flex PCB Assembly Thickness 0.2mm 3.0mm Minimum Trace Spacing 3 Mil

Blue Soldermaskcolor Rigid Flex PCB Assembly Thickness 0.2mm 3.0mm Minimum Trace Spacing 3 Mil

Brand Name: Support OEM / ODM
Model Number: Rigid Flex PCB Assembly
MOQ: 1-10 pcs
Price: USD 5–500/pc
Payment Terms: T/T,Western Union,Paypal
Supply Ability: Double Sided: 12000 sq m / month Multilayers: 8000sq.m / month
Detail Information
Place of Origin:
China
Certification:
ISO9001, TS16949, UL, RoHS
Soldermaskcolor:
Green, Black, White, Blue
Minimumtracespacing:
3 Mil (0.075 Mm)
Thickness:
0.2mm To 3.0mm
Assemblytype:
SMT, Through-hole, Mixed
Operatingtemperaturerange:
-40°C To 125°C
Leadtime:
7 To 21 Days
Material:
Flexible Polyimide And Rigid FR4
Flexibility:
Flexible And Rigid Sections Combined
Layers:
1~64 Layers
Packaging Details:
Vacuum Package+Carton Box
Supply Ability:
Double Sided: 12000 sq m / month Multilayers: 8000sq.m / month
Highlight:

Rigid Flex PCB Assembly 0.2mm

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3.0mm Rigid Flex PCB Assembly

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3 Mil Rigid Flex PCB

Product Description

Product Description:

The Rigid Flex PCB Assembly is an advanced and highly reliable solution that combines the benefits of both rigid and flexible circuit technologies into a single, cohesive unit. Designed to meet the evolving needs of modern electronics, this product integrates flexible and rigid sections seamlessly, offering unparalleled versatility and performance. The combination of these two types of circuit boards allows for complex designs that can conform to various shapes and sizes, making it ideal for a wide range of applications.

One of the standout features of this Rigid Flexible Circuit Assembly is its exceptional precision in trace width and spacing. With a minimum trace width of 3 mil (0.075 mm) and a minimum trace spacing of 3 mil (0.075 mm), this assembly enables the creation of highly detailed and compact circuit layouts. This precision is critical for ensuring signal integrity and optimal electrical performance, especially in applications where space is at a premium.

The Rigid Flexible Board Assembly is engineered to include sophisticated via technologies such as microvias, blind vias, and buried vias. These via types enhance the connectivity between different layers of the circuit, facilitating complex multi-layer designs while maintaining a compact form factor. The use of microvias helps reduce signal loss and improve high-frequency performance, which is essential for applications requiring high-speed data transmission and reliable electrical connections.

Flexibility is a defining characteristic of this Rigid Flexible Circuit Assembly. By combining flexible and rigid sections, the assembly can bend and fold without compromising structural integrity or electrical performance. This flexibility opens up new possibilities in product design, allowing electronic devices to be more compact, lightweight, and ergonomic. The flexible sections can accommodate movement and vibration, which is especially beneficial in dynamic environments.

This Rigid Flexible Board Assembly is widely applicable across several high-tech industries. In wearable devices, its lightweight and flexible nature allows for comfortable, unobtrusive integration into clothing and accessories, enhancing user experience without sacrificing functionality. In the aerospace sector, the durability and reliability of these assemblies ensure that critical systems perform flawlessly under extreme conditions, including vibration, temperature fluctuations, and mechanical stress.

Medical devices also benefit significantly from the Rigid Flexible Circuit Assembly. The ability to create compact, reliable, and flexible electronic assemblies supports the development of cutting-edge diagnostic and therapeutic equipment. These assemblies can conform to the unique shapes required for medical instruments, implantable devices, and portable health monitors, improving patient outcomes and device usability.

Consumer electronics represent another major application area for the Rigid Flexible Circuit Assembly. As devices become increasingly smaller and more feature-rich, the need for compact, high-density interconnections grows. This assembly meets those demands by providing a robust, flexible solution that can be integrated into smartphones, tablets, laptops, and other gadgets, enhancing both performance and durability.

In summary, the Rigid Flexible Circuit Assembly offers a sophisticated, high-performance solution that addresses the challenges of modern electronic design. With its minimum trace width and spacing of 3 mil (0.075 mm), advanced via technologies including microvias, blind and buried vias, and the unique combination of flexible and rigid sections, it is ideally suited for applications in wearable devices, aerospace, medical devices, and consumer electronics. This assembly not only improves device functionality and reliability but also enables innovative design possibilities that drive the future of electronics.

 

Features:

  • Product Name: Rigid Flex PCB Assembly
  • Soldermask Colors Available: Green, Black, White, Blue
  • Minimum Trace Spacing: 3 Mil (0.075 mm)
  • Testing Methods: AOI, X-ray, Flying Probe Test
  • Thickness Range: 0.2mm to 3.0mm
  • Assembly Types: SMT, Through-hole, Mixed
  • Suitable for Rigid Flex PC Board Assembly applications
  • Ideal for Rigid Flexible Board Assembly projects
  • Supports advanced Rigid Flex Circuit Assembly processes
 

Technical Parameters:

Thickness 0.2mm To 3.0mm
Surface Finish ENIG, HASL, OSP, Immersion Silver
Testing AOI, X-ray, Flying Probe Test
Assembly Type SMT, Through-hole, Mixed
Minimum Trace Width 3 Mil (0.075 mm)
Lead Time 7 To 21 Days
Via Type Microvias, Blind And Buried Vias
Operating Temperature Range -40°C To 125°C
Minimum Trace Spacing 3 Mil (0.075 mm)
Solder Mask Color Green, Black, White, Blue
 

Applications:

The Rigid Flex PC Board Assembly is an advanced solution designed to meet the demanding needs of modern electronic applications. Combining both flexible and rigid sections, this Rigid Flexible Board Assembly offers unparalleled versatility and reliability, making it ideal for complex designs that require dynamic bending and stable mounting. The integration of microvias, blind, and buried vias ensures high-density interconnections, supporting miniaturization and enhancing signal integrity across the board.

This product is widely used in various application occasions and scenarios where space optimization and mechanical flexibility are critical. In wearable technology, the Rigid Flex PC Board Assembly accommodates the compact and irregular shapes of devices such as smartwatches and fitness trackers, enabling comfortable wear without compromising electronic performance. Similarly, in medical devices, the flexible sections allow for ergonomic device designs that conform to the human body, while the rigid sections provide stable platforms for sensitive components.

In aerospace and defense applications, the Rigid Flex PC Board Assembly is essential for withstanding harsh environments and mechanical stresses. Its robust construction, combined with high-reliability vias, ensures consistent performance in avionics systems, satellite communications, and unmanned vehicles. The use of various soldermask colors, including green, black, white, and blue, allows for customization to meet specific industry standards or enhance visual inspections during assembly and maintenance.

Automotive electronics also benefit significantly from Rigid Flexible Board Assembly technology. The ability to combine rigid and flexible sections enables the design of compact control units, sensors, and infotainment systems that can be integrated into tight spaces within vehicles. Moreover, the product undergoes rigorous testing methods such as AOI (Automated Optical Inspection), X-ray analysis, and Flying Probe Test to ensure quality and reliability, which are paramount in safety-critical automotive components.

With a lead time ranging from 7 to 21 days, this Rigid Flex PC Board Assembly offers a balance between rapid prototyping and scalable production, making it suitable for both innovative startups and established manufacturers. Whether used in consumer electronics, industrial automation, or telecommunications, the Rigid Flex PC Board Assembly delivers exceptional performance and durability, meeting the evolving demands of cutting-edge technology applications.

 

Packing and Shipping:

Our Rigid Flex PCB Assembly products are carefully packaged to ensure maximum protection during transit. Each assembly is placed in an anti-static bag to prevent electrostatic discharge and then cushioned with protective foam or bubble wrap to avoid physical damage.

The packaged assemblies are then securely placed in sturdy, appropriately sized boxes to minimize movement and impact. For additional safety, desiccant packs are included to control moisture and maintain product integrity.

We offer various shipping options to meet your requirements, including standard, expedited, and overnight delivery. All shipments include tracking information and are handled with care by our trusted logistics partners to ensure timely and safe delivery to your specified location.

 

FAQ:

Q: What is a Rigid Flex PCB Assembly?

A: Rigid Flex PCB Assembly is a combination of rigid and flexible circuit boards integrated into a single unit, allowing for complex designs with both durable and bendable sections.

Q: What are the primary applications of Rigid Flex PCB Assemblies?

A: They are commonly used in aerospace, medical devices, consumer electronics, and wearable technology due to their reliability, compactness, and ability to withstand dynamic movements.

Q: What materials are typically used in Rigid Flex PCB Assemblies?

A: These assemblies usually utilize flexible polyimide substrates for the flex sections and FR4 or similar materials for the rigid parts, ensuring durability and flexibility where needed.

Q: Can Rigid Flex PCB Assemblies help reduce the overall product size?

A: Yes, by integrating flexible and rigid circuits, they allow for more compact designs and reduce the need for connectors and cables, leading to smaller, lighter products.

Q: What design considerations are important for Rigid Flex PCB Assembly?

A: Key considerations include the bend radius of the flexible sections, layer stack-up, thermal management, and ensuring proper alignment between rigid and flex areas to maintain signal integrity and mechanical reliability.