Halogen free High Density Interconnect Pcb 2 N 2 for UAV brushless electric

Place of Origin Shenzhen, China
Brand Name Ben Qiang
Certification ISO/TS16949/RoHS/TS16949
Model Number FR-4/Rogers
Minimum Order Quantity 1PCS
Price custom made
Packaging Details Air bead vacuum packaging
Delivery Time 3-7 days delivery
Payment Terms Bank Transfer/Alipay/PayPal
Supply Ability 200,000 square meters/year

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Product Details
Application UAV Brushless Electric Characteristic 2 Oz Copper HDI
Material S1000-2M Layer 12L
Thickness 2.2±0.2mm Min Hole Diameterv Laser Hole :0.2mm Mechanical Hole 0.2mm. Aspect Ratio:11:1
Min Width/space 140/180um Surface Finish ENIG(0.05um)
Internal Model E339030C12
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High Density Interconnect Pcb 2 N 2

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Halogen Free High Density Interconnect Pcb

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Product Description

HDI with 2+N+2

Project PCB process capability
Layer count 1-40 Layers
Min outer line width/space 3/3mil
Outer copper thickness 280um(8OZ)
Inner copper thickness 210um(6OZ)
Tolerance of PCB thickness board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers
board thickness>1.0mm; ±10%
Minimum PTH Mechanical hole 4mil, laser 3mil
Material FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide
HDI Levels 2-7
Special Process

Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance;