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HDI High Density Interconnect PCB 36 layer S1000-2M Material

HDI High Density Interconnect PCB 36 layer S1000-2M Material

Brand Name: Ben Qiang
Model Number: FR-4/Rogers
MOQ: 1PCS
Price: custom made
Payment Terms: Bank Transfer/Alipay/PayPal
Supply Ability: 200,000 square meters/year
Detail Information
Place of Origin:
Shenzhen, China
Certification:
ISO/TS16949/RoHS/TS16949
Application:
Semiconductor Test PCB
Characteristic:
Laser Drill, Aperture Ratio 24:1
Material:
S1000-2m
Layer:
36L
Thickness:
4.8mm±0.24mm
Min Hole Diameterv:
Laser Hole: 0.10mm; Mechanical Hole: 0.2mm Aperture Ratio: 24:1
Min Width/space:
150/95um
Surface Finish:
Immersion Gold 3U"
Internal Model:
S330V85C36
Packaging Details:
Air bead vacuum packaging
Supply Ability:
200,000 square meters/year
Highlight:

High Density Interconnect Pcb 36 Layer

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Hdi High Density Interconnect Pcb

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hdi in pcb S1000-2m

Product Description

36-layer 2-level HDI version semiconductor test board

Project PCB process capability
Layer count 1-40 Layers
Min outer line width/space 3/3mil
Outer copper thickness 280um(8OZ)
Inner copper thickness 210um(6OZ)
Tolerance of PCB thickness board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers
board thickness>1.0mm; ±10%
Minimum PTH Mechanical hole 4mil, laser 3mil
Material FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide
HDI Levels 2-7
Special Process

Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance;