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1+N+1 HDI Printed Circuit Boards 210um Inner Copper Thickness
Place of Origin | Shenzhen, China |
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Brand Name | Ben Qiang |
Certification | ISO/TS16949/RoHS/TS16949 |
Model Number | FR-4/Rogers |
Minimum Order Quantity | 1PCS |
Price | custom made |
Packaging Details | Air bead vacuum packaging |
Delivery Time | 3-7 days delivery |
Payment Terms | Bank Transfer/Alipay/PayPal |
Supply Ability | 200,000 square meters/year |
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xProduct Details
Application | Bluetooth Headset | Characteristic | 1 Laser,2 Lamination, 1+N+1 |
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Material | S1000-2m | Layer | 6L |
Thickness | 1.8±0.18mm | Min Hole Diameterv | Laser Hole :0.1mm Mechanical Hole 0.15mm. Aspect Ratio:4:1 |
Min Width/space | 0.127mm(BGA) | Surface Finish | Immersion Gold: 0.05um |
Internal Model | C449027C06 | ||
Highlight | 1 N 1 Hdi Printed Circuit Boards,Hdi Printed Circuit Boards 210um,Hdi Multilayer Pcb 210um |
Product Description
HDI with 1+N+1
Project | PCB process capability |
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Layer count | 1-40 Layers |
Min outer line width/space | 3/3mil |
Outer copper thickness | 280um(8OZ) |
Inner copper thickness | 210um(6OZ) |
Tolerance of PCB thickness | board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers board thickness>1.0mm; ±10% |
Minimum PTH | Mechanical hole 4mil, laser 3mil |
Material | FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide |
HDI | Levels 2-7 |
Special Process |
Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance; |
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