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High Tg Semiconductor PCB HDI Printed Circuit Board 4 N 4

High Tg Semiconductor PCB HDI Printed Circuit Board 4 N 4

Brand Name: Ben Qiang
Model Number: FR-4/Rogers
MOQ: 1PCS
Price: custom made
Payment Terms: Bank Transfer/Alipay/PayPal
Supply Ability: 200,000 square meters/year
Detail Information
Place of Origin:
Shenzhen, China
Certification:
ISO/TS16949/RoHS/TS16949
Application:
Semiconductor Testing
Characteristic:
4 Laser, 5 Lamination, 4+N+4
Material:
Shengyi S1000-2M
Layer:
12L
Thickness:
4.4±0.4mm
Min Hole Diameterv:
Laser Hole: 0.127mm, Mechanical Hole 0.3mm. Aspect Ratio:15:1
Min Width/space:
127/85um
Surface Finish:
ENIG(0.05um)
Internal Model:
C330L48C08
Packaging Details:
Air bead vacuum packaging
Supply Ability:
200,000 square meters/year
Highlight:

High Tg Semiconductor PCB

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Semiconductor PCB Hdi

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Hdi Printed Circuit Board 4 N 4

Product Description

HDI with 4+N+4

Project PCB process capability
Layer count 1-40 Layers
Min outer line width/space 3/3mil
Outer copper thickness 280um(8OZ)
Inner copper thickness 210um(6OZ)
Tolerance of PCB thickness board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers
board thickness>1.0mm; ±10%
Minimum PTH Mechanical hole 4mil, laser 3mil
Material FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide
HDI Levels 2-7
Special Process

Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance;