Project | SMT processing capacity |
---|---|
SMT capacity | 10 million solder joints/day |
SMT production line | 8 |
Surplus | Resistance and capacitance: 0.03% |
IC: 0% | |
Board type | POP/PCB/FPC/Rigid-flex board/HDI/High Frequency&Speed PCB/Metal-PCB |
Mounting component precision | Minimum package: 03015CHIP/0.20PLT |
Minimum Component Accuracy:±0.034MM | |
IC placement accuracy: ± 0.025MM | |
PCB SPEC |
PCB size: 50*50MM~774*710MM |
PCB thickness: 0.3~6.5MM |
Project | SMT processing capacity |
---|---|
SMT capacity | 10 million solder joints/day |
SMT production line | 8 |
Surplus | Resistance and capacitance: 0.03% |
IC: 0% | |
Board type | POP/PCB/FPC/Rigid-flex board/HDI/High Frequency&Speed PCB/Metal-PCB |
Mounting component precision | Minimum package: 03015CHIP/0.20PLT |
Minimum Component Accuracy:±0.034MM | |
IC placement accuracy: ± 0.025MM | |
PCB SPEC |
PCB size: 50*50MM~774*710MM |
PCB thickness: 0.3~6.5MM |