PCB Manufacturing Capabilities

January 25, 2024
Latest company case about PCB Manufacturing Capabilities
Project PCB process capability
Layer count 1-60 Layers
Min outer line width/space 3/3mil
Outer copper thickness 280um(8OZ)
Inner copper thickness 210um(6OZ)
Tolerance of PCB thickness board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers
board thickness>1.0mm; ±10%
Minimum PTH Mechanical hole 4mil, laser 3mil
Material FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide
HDI Levels 2-7
Special Process

Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance;